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WAFERNET SERVICE INFORMATION Services Main | Thermal Oxide
 

WaferNet, Inc. offers blanket films services for an easy turn-key solution for our customers. Some standard products like Thermal Oxide Silicon Wafers in 1,000 angstrom and 5,000 angstrom thicknesses on 200mm silicon test wafers and 300mm silicon test wafers are available directly from our inventory. Other thicknesses of thermal oxide silicon wafers including ultra-thin 30 angstroms to ultra-thick 24,000 angstroms can also be sourced.

WaferNet utilizes unique industry alliances to provide silicon wafers in a wide range of diameters, grades, and specifications. Our extensive, on-site inventory allows us to quickly respond to large volume and complex requirements. Match your service needs with WaferNet's inventory by searching our summary of specifications or by filling out a service request form.

Need a custom service that is not listed? Connect with us via phone, fax or email to discuss your requirements in more detail.

 
DIELECTRIC FILM THICNESS RANGE SPECIFICATION
Thermal Oxide 30 angstroms - 24,000 angstroms +/- 5% WIWNU*
BPSG 10,000 angstroms - 20,000 angstroms
Specify Boron and Phosphorus concentration
<=3% WIWNU
3mm edge exclusion Anneal available
PECVD TEOS 1,700 angstroms - 30,000 angstroms <=2% WIWNU
3mm edge exclusion
PECVD HDP 4,500 angstroms - 8,000 angstroms <=3% WIWNU
3mm edge exclusion
PECVD SiN 1,000 angstroms - 5,000 angstroms <3% WIWNU
3mm edge exclusion
 
METAL FILM THICKNESS RANGE SPECIFICATION
Barrier Films (Ta/TaN/Ti/TiN) 100 angstroms - 2,000 angstroms Several CVD and PVD deposition tools available 3%-5% WIWNU*
Tungsten 4,500 angstroms - 9,000 angstroms Both CVD and PVD deposition tools available <3% WIWNU
PVD Copper Up to 15,000 angstroms <=5% WIWNU
Electroplated Copper 10,000 angstroms - 15,000 angstroms <=4% WIWNU
3mm edge exclusion
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